Multi-Layer Encapsulation for Superior Protection & Perfomance

SHEETSOL Private Limited is a leading manufacturer & supplier of high-performance encapsulant sheets for the solar PV industry, offering advanced EVA, POE, and EPE Encapsulant Solutions. With a fully equipped manufacturing facility featuring high-tech extrusion and lamination lines, and a dedicated R&D and Quality assurance department, SHEETSOL ensures consistent innovation, Quality, and precision in every product we deliver.

The SHEETSOL SS-UFC-T100-EPE Encapsulant represents the next evolution in solar encapsulation — a multi-layered composite structure that combines the proven benefits of EVA (Ethylene Vinyl Acetate) and POE (Polyolefin Elastomer). Designed for modern high-efficiency PV modules, this encapsulant provides exceptional PID resistance, Moisture barrier properties, and long-term Durability, making it ideal for glass-glass and glass-Backsheet configurations.

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Why Choose SHEETSOL UFC-T100-EPE?

At SHEETSOL, We believe that true innovation lies in protection that lasts. The SS-UFC-T100-EPE Encapsulant is engineered to safeguard every solar cell with Unmatched Reliability, Flexibility, & Stability. By combining the adhesive strength of EVA with the advanced barrier properties of POE, This Encapsulant delivers the perfect balance of process efficiency and long-term performance — helping solar module manufacturers achieve Excellence in Quality, Endurance & Energy Output.

Key Features & Advantages

Superior PID Resistance

The central POE layer minimizes Potential Induced Degradation (PID) by providing excellent electrical insulation, ensuring sustained power output and enhanced reliability under high voltage and humid conditions.

Excellent Moisture & Oxygen Barrier

The multi-layer composition significantly reduces water vapor and oxygen transmission, protecting the cells and interconnections from corrosion, delamination, and mechanical stress.

Enhanced Adhesion & Processability

Outer EVA layers ensure strong adhesion to glass and backsheet materials, while the optimized flow characteristics improve lamination efficiency and production consistency.

Optimized Lamination Time

The Encapsulant is designed for fast and stable lamination, with an optimized process time of approximately 420 seconds, suitable for both standard and high-speed module production lines.

Outstanding UV and Thermal Stability

Maintains optical clarity, high light transmittance, and mechanical flexibility even under prolonged UV exposure and thermal cycling, ensuring consistent performance across the module’s lifetime.